In one embodiment, a computing device includes an outer housing having opposed sides, and a mounting feature provided on one of the opposed sides of the outer housing, the mounting feature being configured to secure the computing device to another object. Each of the via contact means is composed of a via hole, as a through-hole, formed in the substrate, a metal film disposed on the inner peripheral surface of the via hole, and a solder filled into the cavity defined by the metal film. Due to such a constitution, the withstand voltages in the respective regions can be suppressed to low values. This will save you money on your electric bill so that you can keep cool without using your air conditioner.