An integrated circuit package separator method for separating integrated circuit packages from a board having a plurality of integrated circuits. The filter is made up of resonators, such that the filter resonates a design frequency. The first portion of the electronic equipment includes an air intake opening. The contact angle of a drop of physiological saline to the surface of the liquid-pervious layer is at least 35, and the electrostatic chargeability of the liquid-absorbing layer is lower than that of the liquid-pervious layer. The aim of the invention is to process higher maximum levels of the source signal and to suppress noises of the second amplifier.