The invention proposes an interposer assembly architecture for noise suppression circuits on the package of a CPU or high power, high frequency VLSI device. The present invention also relates to pharmaceutical compositions of compounds of formula, which are useful for treating a disorder selected from the group consisting of chronic inflammatory pain, neuropathic pain, inflammation, neurodegeneration, depression and promoting neuroregeneration. Such sampling or sensing may be provided by a downhole tool in accordance with some embodiments of the present invention and the downhole tool may be used for production logging, formation testing andor the like. The inner needle rotates within the outer guide by manipulation of the hub; and a distal tip of the inner needle is deployed out of and beyond a distal tip of the outer guide.