Methods and systems for ultrasound imaging are presented. A fabrication process includes an all top-side processing for the formation of fluidic channels, planar fluidic interface ports, integrated metal electrodes for impedance measurements, and a glass cover sealing the non-planar topography of the chip using spin-on-glass as an intermediate bonding layer. A wafer of the invention is an epitaxial wafer having an epitaxial layer being 0.