A semiconductor subassembly is provided for use in a switching module of an inverter circuit for a high power, alternating current motor application. A thermally and electrically conductive planar member is attached to an inactive side of the chip through a thermally and electrically conductive adhesive layer. In one embodiment, the conductive baseplate is enveloped by the insulation layer, and the antennae penetrate through the insulation layer and connect to one side of the conductive baseplate.