A solder bump on a semiconductor substrate is provided. In an array of power generating components that are connected in parallel to a power bus, a power generating component measures an output current that it supplies to the power bus. The telecommunication system is configured to operate based on the loaded data in internal memory when the system operates in normal mode. The plurality of optical elements are positioned to direct the light beam from the light source to the receiver, which is positioned to receive the light beam supplied by the light source.