An inductor formed on a semiconductor substrate, comprising a coil formed with at least a single metal layer having a plurality of slots and an insulator layer filled in the plurality of slots, wherein the insulator layer is encompassed in the single metal layer and the insulator layer does not cover the top surface of the single metal layer. The multi-chip package of the present invention has a plurality of shelves. , a tumor genome, when compared to a reference genome. One location portion is provided with a first fixing socket extending radially from the inner surface of the body, towards the outer surface of the body.