A semiconductor device which, in spite of the existence of a dummy active region, eliminates the need for a larger chip area and improves the surface flatness of the semiconductor substrate. Depending on the embodiment, each group may have one or more participants. An FSI image sensor wafer may be used as a handle wafer for a BSI image sensor wafer when it is thinned, thereby decreasing the thickness of the overall camera module. A processing circuit estimates a level of background noise from the microphone output and sets a power conservation mode of the personal audio device in response to detecting that the background noise level is lower than a predetermined threshold. The base station uses the CQI information to select a UE for scheduling of downlink transmission and the quantized beamforming matrix index received from the selected UE to beamform the downlink transmission to the UE. Both the supply of propellant and the supply of paintballs are carried on the torso of the player, positioned remote from the marker, thereby easing the weight on the player’s wrist.