An image pickup apparatus which is capable of removing foreign substance, such as dust, attached to an optical member disposed in front of an image pickup element, even when accessories are exchanged in a power-off state of the image pickup apparatus. The method selects a data chunk, where that data chunk comprises all or a portion of the data set, performs a first stage deduplication analysis of the data chunk using the first stage deduplication algorithm. The unobstructed perimeter area provides an area of improved absorption and allows the side-by-side simultaneous placement of the thermal bag and the absorbent pad on a wound site. A third region having a second conductivity type opposite the first conductivity type is arranged on or in the semiconductor film side by side with the second region in a width direction of the first gate electrode.