According to an embodiment of the present invention is to provide methods to evaluate the impact of scrapped wafers on the remaining wafers in a lot by using scrap codes and statistical models. The display structure improves sensitivity in detecting shorts or opens in data signal lines. A light emission layer is interposed between a first and a second electrode. However, the driving environment may change rapidly when the vehicle moves and may severely affect quality of the images captured. The circuit includes an encoder for encoding the incoming XFI signal into four signals in the XAIU format, and a decoder coupled to the XAUI interface for receiving a four lane XAUI signal and converting it into a serial XFI signal coupled to the XFI interface.