A metal-insulator-metal capacitor includes a first electrode in a first wiring level, a second electrode above the first wiring level and extending into a first portion of the first electrode that surrounds the second electrode, and a dielectric film separating the first electrode from the second electrode. The parts are matched to different links or channels having respective COS characteristics and communicated over the links or channels, and then aggregated at the receiver. The two ends of the tube, following the bend, are measured to determine the distance between the end face of each leg to the bend axis. The second metal layer on the textured metal semiconductor alloy is then annealed to form a metal semiconductor alloy contact, in which metal elements from the second metal layer are diffused through the textured metal semiconductor alloy to provide a templated metal semiconductor alloy. The method also includes calculating a first impedance downstream of the power conversion assembly based on the first operational measurement.