Examples of a pressure wave generator configured to generate high energy pressure waves in a medium are disclosed. The management tool can be configured to provide control, management, and maintenance of the software appliance. A method of packaging the IC die includes placing the IC die on the adhesive film with its active surface and bond pads in contact with an adhesive side of the film. The mechanism may be adapted for reciprocal longitudinal movement within the housing between a first position corresponding to a first dimension of the passageway and a second position corresponding to a second dimension of the passageway.