A polishing pad used in a CMP step in the manufacture of a semiconductor integrated circuit device is relatively expensive; thus, it is necessary to avoid a wasteful exchange of the pad. Powder is adhered on the latent image supporter to develop a latent image on the latent image supporter and a transporting member is arranged opposite to the latent image supporter. An MS with a maximum channel capacity is selected from among the classified MSs. In accordance with a photo-curing material of the MAV layer, the fabricating method of the present invention has simple processes with low technical requirements. The combined signal is transmitted as the combined spread spectrum signal.