An improved material for use in resilient conforming pads, cushions, impact resistance padding and the like is described. The semiconductor processing system includes a number of processing tools, a number of processing modules, and a number of sensors. A fiber amplifier is provided having a plurality of individual cores including at least one pump core and a plurality of amplifier core. The members of a spectral library of known, pure components are examined based on this reduced dimensionality data space using target factor testing techniques. The print head is movable between a printing position and a cleaning position.