A low-capacitance bonding pad for a semiconductor device. The outer wall of the cup receptacle is constructed of a light transmitting material that is uniformly illuminated by light emitted from the light source. The invention further relates to methods for producing other witloof chicory lines derived from the cultivar \u2018BOBINE\u2019. The tab extends away from the plane of the lens to a geniculation spaced from the lens plane. A sub-aN\u221aHz force sensitivity is obtained by scaling down the dimensions of the cantilevers and supplying an optimum bias power as a function of temperature and geometry. The RF pick-up probe, RF choke, and DC output line are preferably disposed with an antenna transition element for coupling a horn antenna to a matched diode detector which provides the aforementioned DC voltage.