A thermally conductive sheet comprising boron nitride powder as a first thermally conductive filler dispersed into an organic matrix, wherein the boron nitride powder is hexagonal boron nitride, and comprises primary particles and secondary aggregates formed by aggregation of the primary particles, wherein at least part of the secondary aggregates being 50 m or more in size. The support structure having ink conduits for supplying the array of nozzles. The shield protects wires, extending from electrodes to the proximal end of the probe, from undesired interference of external RF fields. In preferred embodiments, the present invention provides the the ImmunoChip. The first chamber is sandwiched between Cell-1 and Cell-2.