An electroless nickel plating liquid capable of forming an underbarrier metal for metal bumps or solder bumps by electroless nickel plating with a uniform film thickness on silicon wafers composed of multiple IC chips contains a water-soluble nickel salt, a reducing agent, a complexing agent, and a pH buffer, wherein_lead ion is contained at 0. Gate electrodes including gate conductive patterns and capping patterns are formed on the memory cell region and the peripheral circuit regions. A single person could use both hands to operate and control.