A semiconductor device has a first semiconductor die mounted over a carrier. In an embodiment, an antiperspirant application device includes a skin-adhesive, transdermal patch including an adhesive compound capable of adhesion to human skin and an antiperspirant active compound based upon an astringent metallic salt disposed within at least a portion of the skin-adhesive, transdermal patch. In another example the first party and the second party deal directly with one another. A source of electrical signals provides the power to heat the material intermediate the pair of jaws.