Semiconductor fabricating technology is provided, and particularly, a method of fabricating a semiconductor device improving a contact characteristic between a silicon layer including carbon and a metal layer during a process of fabricating a semiconductor device is provided. The pusher has a head portion provided with a resisting portion, a shaft and a depressing portion. The first of the openings surrounds a substrate support of the table and the second of the openings extends around an outer edge of the table. Using the replacement Identify-Drive data, the CPU updates the Identify-Drive data stored in the controller. Methods of using the apparatus are also presented.