An integrated circuit package structure having an array of metal pegs connected by printed circuit lines. The device includes a tensioning structure for providing adjustable resistance. Control circuitry includes a voltage sensor sensing Vout and a voltage level generator for generating a first voltage level coupled to the CP stage and a second voltage level coupled to a duty cyclerate generator block providing an input to an under voltage monitor coupled between OUT and the control logic. The lower pavilion facets lie at an angle of between 35 and 45 relative to the girdle plane. An at least one lighting element emits light and communicates with the laminar flow tube or segment. The PMOS transistor is formed over a silicon germanium layer to have a compressive strain structure, thereby increasing hole mobility of a channel region in operation of the device.