A polishing head of a chemical and mechanical polishing apparatus can uniformly polishing a wafer by sticking the wafer firmly and with uniform pressure to a polishing pad. The method includes determining if an aspect ratio of the input window is equal to an aspect ratio of an image output resolution; and adjusting the aspect ratio of the input window when the aspect ratio of the input window is not equal to the aspect ratio of the image output resolution. Methods of fabricating the wiring devices to include antimicrobial agents includes adding a prescribed amount of antimicrobial agent to a base material, mixing the agent and material to create a mixture, and extruding the mixture into one or more molds to form a wiring device of desired configuration.