In one embodiment of the invention, an optical attenuation device has an inputoutput 6 on which a multiplexed optical input stream is received. The method includes adjusting the target skew of a reference ROS within one of the plurality of imaging stations by the angular difference between the actual reference ROS position and the target position for the reference ROS and adjusting the target skew of the reference ROS by the skew of the reference ROS relative to the desired skew for image squareness. The binding elements may be configured helically around the conductor core. In some embodiments, a thickness of the wavelength converting material on a side of the semiconductor structure is at least 25% of a thickness of the wavelength converting material over a top of the semiconductor structure. when a printed circuit board having the BGA package mounted thereon is carelessly dropped during the manufacturing work, at the outer or peripheral portion of the BGA package, which is most sensitive to such a shock, the shock is absorbed by the reinforcing bumps and reinforcing footprints which have no electrical connection with the circuitry of the electronic component package.