When thermally perforating a thermoplastic resin film of heat-sensitive stencil material by the use of a thermal head, supply of energy to the thermal head is cut at a time the diameter of the perforations becomes not smaller than 65% and not larger than 95% of a target diameter of the perforations. A user may reshape and or resize one or more of the atomic three dimensional objects prior to joining the three dimensional objects together at the appropriate parameterized join features to form one or more of the complex three dimensional objects. Also included in the Playing Grid are a network of Branches interconnecting said nodes.