A semiconductor device has an interposer with a die attach area interior to the interposer and cover attach area outside the die attach area. The arrangement includes a provision for crediting a collection to principal of the money market note, if the principal of the money market note is not fully credited, and a provision for crediting the collection to principal of the term note, if the principal of the money market note is fully credited. A pixel electrode is arranged on the passivation layer and is electrically connected with the extended portion of the drain electrode through the contact hole. An operation structure is coupled to the shuttle plate and is configured to perform an operation on a molded article disposed either in the mold cavity or on the mold core. When in its operative position, the conveyor is disposed at a 45 angle to the horizontal so as to be in the path of the cut crop discharged by the conditioner, the conveyor having a lateral extent such as to deposit the crop in a windrow located outside a selected one of the front pair of support wheels. Coated soy products or coated flours made using the process of the invention are also disclosed.