Disclosed herein is an inertial sensor. The wafer first undergoes a polishing process, in which a predetermined portion of the wafer is polished away from its back side. The alloying additives are selected for phase stability and to retard agglomeration. The antenna element is electrically coupled with the electrically conductive layer across the opening end via a matching circuit, and receives an electric power through one end of the antenna element. An anti-icing chamber is placed around the injection nozzle and a third fluid is provided to the anti-icing chamber to form an interface which does not allow the first fluid to contact the injection nozzle.