The present invention relates to inorganic monolithic mouldings whose surface is coated with physi- or chemisorbed organic polymers, and to processes for the production of materials of this type. The release layer, that may be an admixture of a metal such as nickel or chromium and a non-metal such as chromium oxide, nickel oxide, chromium phosphate or nickel phosphate, provides a release force for the metal foil layer from the carrier strip that is typically on the order of 0. Moreover, these improved methods and structures can be used in conjunction with existing fabrication and processing techniques with minimal or no added complexity. The chip can have triangular light emitting elements that improve light extraction from the semiconductor.