A method of manufacturing a semiconductor device, comprising the steps of:. The rotation of the securing member by the wrapping device is powered by power supplied via a power conduit in the form of an elongate flexible conduit wrapped onto a power conduit drum that has a central axial bore arranged concentrically with the load bearing elongate member during handling of the load. The sensors, which can be single element sensors or sensor arrays, can be used to periodically inspect selected locations, mounted to the test material, or scanned over the test material to generate two-dimensional images of the material properties. A second circuit board provides POTS.