A semiconductor package that can fit semiconductor chips of various sizes without having to change the footprint of the carrier package. This metadata can be dynamically updated as a user experiences media content and then used to impart to the user a personalized experience that is tailored to that specific user. A high level mechanism based on the Extensible Markup Language is used to declare the structure and behavior of modeled persistent objects that exhibit functionally complete object orientation and whose implementations are realized through packages of database stored procedures and associated structures. Also provided is a kit for converting a previously manufactured air motor assembly that requires oil or added lubricant to an oilless air motor assembly.