An electronic assembly includes a casing of an electronic product, and a thermal module disposed in the casing. A first programmable logic device die includes first and second portions, and is encoded to render the first portion operational and the second portion non-operational. Higher convergence rate is achieved when flattened signals pass through the echo canceller. The method includes depositing a biological material over the substrate, the biological material having an affinity for a pn junction material, and exposing the deposited biological material to the first pn junction material to form a doped area of a pn junction.