1461160295-f98190d7-8a05-466d-b085-6160178881ce

According to one embodiment, a method for manufacturing a semiconductor device includes forming trenches in a first side of a semiconductor material and forming a thick oxide layer on the trenches and on the first side. The image processing device has a distortion correction technique for images displayed on the projection surface. A first determination unit determines whether the expiration date expires based on the acquired information. A given one of the encoder-selector cells has a unique set of both multiplier operand inputs and multiplicand operand inputs, and produces a single partial product bit. The capacitive coupling between the transmitter electrodes and the second plurality of sensor electrodes is configured to vary in response to the applied force.