The invention provides a mesa semiconductor device and a method of manufacturing the same which minimize the manufacturing cost and prevents contamination and physical damage of the device. The conductive buffer material includes an inclusion material and a conductive envelope material that wraps the inclusion material, and the conductive buffer material includes a main portion in which part of the envelope material is brought closer to the first panel surface and the first member by the inclusion material having a given thickness or more. The control information includes a first speed information indicating a maximum recording speed, a second speed information indicating a minimum recording speed, and a third speed information indicating one or more basic recording speeds. The tenon is disposed on the first side of the engaging arm adjacent to the second end. As a result of exposure to hydrogen peroxide andor peracetic acid, the colorants change color, and even become colorless, thereby providing an indication of the presence of hydrogen peroxide andor peracetic acid. Each of the plurality of cache-lines and each of the plurality of sub-cache lines is associated with meta-data indicating one or more of a dirty state and an invalid state.