An X-ray tube anode assembly, an X-ray tube assembly and a method for heat management to an X-ray assembly having a movable X-ray target having a target surface. Solder bumps are selectively applied in a solder bump integrated circuit packaging process so that portions of a circuit can be effectively disabled. The mechanical linkage includes a bellcrank rotatable about an axis, a first bellcrank arm having a first clevis at an inner end, and a first pin extending through the first clevis and a first flange of the bellcrank to fasten the first bellcrank arm to the bellcrank. The vehicle has a ground clearance of greater than 30 inches. A cover layer is applied over the fiber and the substrate.