A flow controller is provided for delivering a precise volume of fluid such as high purity fluid streams to a processing destination, such as a wafer processing chamber. On or more retention members are provided on the first surface for engaging a friction material mounted thereon. Each pads has a Cu plating layer and an Au plating layer that is directly formed on the Cu plating layer. In addition, the aggregated software update selection information can be used to produce a subscription set of software update selections corresponding to software to update on the machines. A bridge circuit provides a coupling between the local section and shared section.