An improved structure for the sound coil of loudspeaker comprises a cylinder provided with multiple layers of coils surrounding one end thereon. A temperature measurement start instruction is provided to the controller of the wireless wafer at a position in a wireless wafer carrier, and thereby the wireless wafer starts temperature detection to store time-series data of the detected temperature value in the storing portion. The circuit has particular application to asynchronous multiple processor networks. In a layout view, a first area for placement of the first and second diodes is interposed between at least two separate sets of second areas for placement of the MOS transistor.