A semiconductor structure for a dynamic random access memory cell array that includes a plurality of vertical memory cells built on a semiconductor-on-insulator wafer and a body contact electrically coupling a semiconductor body and a semiconductor substrate of the SOI wafer. The housing has semi-cylindrical sections which receive the spools. One of the feeding members includes a rotating member supported on a shaft for rotation about the axis of the shaft, the shaft being mounted for transverse movement toward and away from the other feeding member to accommodate variations of the thickness of the crumpled strip as it is advanced between the opposed feeding members. A second portion of each through-hole in each mount has a funnel-shaped guide opening toward the pins. The invention also provides compositions comprising a compound of this invention and the use of such compositions in methods of treating diseases and conditions beneficially treated by an agent that inhibits kinases, such as phosphatidylinositol 3-kinase and polo-like kinase.