A stacked semiconductor module is made by stacking a second semiconductor device having a second semiconductor chip mounted to the top surface of a second semiconductor substrate above the top surface of a first semiconductor device having a first semiconductor chip mounted to a first semiconductor substrate. This enables to sharply speed up processing, and minimize a prolonged processing in the CPU to reduce power consumption, when compared to the case of executing by software problem processing. The scanning can include spectral domain scanning, as an example. The release valve is connected to secondary conduits extending between the transformer and the electrical meter installed on an exterior wall of a residential or commercial building. Current usage and time overlaps of two or more peripheral devices are determined using current profiles of the devices.