A reliable, inexpensive \u201cback side\u201d thinning process and apparatus therefor, capable of globally thinning an integrated circuit die to a target thickness of 10 microns, and maintaining a yield of at least 80%, for chip repair andor failure analysis of the packaged die. Accurate VOS assessment requires consideration of technical and economic components. Since the inductance of each inductive element is less, the size of each inductive element may be significantly smaller and the resistive loss of the each inductive element may be significantly smaller. The platform segments each include underlying flanges with axially oppositely directed teeth.