A method for assembling a semiconductor photonic package device includes bonding a portion of a first surface of a semiconductor die portion to a portion of a carrier portion, bonding a single mode optical ferrule portion to a portion of the first surface of the semiconductor die portion, and disposing a cover plate assembly in contact with the optical ferrule portion and the carrier portion. The electro-optical panel is directly bonded to the converging lens array. The rotor also has internal passage means for effecting selective communication between the compression and combustion chambers. The couplers may be implemented as polarization or intensity beam splitters positioned along the optical path. The method is employed on individual networking devices in a distributed manner or is used by a centralized network management system to allocate protection paths. The faceplate electronics include detectors for automatically detecting the capacity of pre-filled syringes.