Wafer-level chip-scale packaging technology is used for improving performance or reducing size of integrated circuits by using metallization of pad-to-bump-out beams as part of the integrated circuit structure. The foam is applied into a partition, which may be a paper ring, by an injection and metering device. A runner of the umbrella is thus capable of being moved around the connector when the umbrella is closed that can decrease the length of the closed umbrella perfectly. Finally, an optional telecommunications link is used to automatically order a source fuel refill when the source fuel runs low. In yet another embodiment, a card may include a relatively soft material that covers at least a portion of the user interface. The shell, radiator assembly and base are mechanically coupled as a unit.