A thin wafer comprising through holes filled at least partially with conductive carbon nanotubes generally oriented transversally to the wafer. A rising edge delay and a falling edge delay of the test signal is equalized by adjusting a body bias voltage of a delay element configured within the selected communication path. A first retainer portion is dimensioned to be slidingly insertable through a bore that is defined within the base of the spike. Also if the device matching the search condition is absent, a device of a high frequency of use, determined on the use history, is outputted as the search result.