A data communication system is configured to communicatively link a host device and a client device with a point-to-point data communication link, where the point-to-point data communication link is configured with multipoint network data communication components designed for data communication over a distributed network. The first bus line is parallel to the second bus line. Adhesive establishes an adhesive bond extending between and bonding to the bonding surface and the workpiece. An optimum component design is selected on the basis of the results of the analysis. The electrically conductive structure extends in the vertical direction through the epitaxial layers with the activated dopant regions toward the III-nitride compound semiconductor device structure, and is electrically connected to the source. In the present invention, an AT in the 1x network can establish a packet data service with an HRPD network when there is an existing packet data session in the HRPD network.