The present invention relates to a line module protection method and a device utilizing that method. The sealing method includes the steps of: cooling an un-encapsulated device; depositing a sealing material over at least a portion of the cooled device to form an encapsulated device; and heat treating the encapsulated device to form a hermetically sealed device. The guide engages width-wise edges of the web and forms the web into a trough to stiffen the web. The continuous phase is reinforced with glass fibers and contains lightweight filler particles, for example, ceramic microspheres. The production of the sheet may be altered based on the measurements.