A multi-chip semiconductor device comprises a thermally enhanced structure, a first semiconductor chip, a second semiconductor chip, an encapsulation layer formed on top of the first semiconductor chip and the second semiconductor chip. The comparison result is supplied to a switching control circuit. One of the punch face strips provided on an upper side of the carrying belt is not covered by the covering film. The utility exports, as one or more transportable tablespaces, one or more database objects that are associated with the identifier in a database. The hafnocene comprises at least one cyclopentadienyl ligand including at least one linear or isoalkyl substituent of at least 3 carbon atoms.