A touch sensing device is provided. This may make the CMOS device easy to make and prevent coefficient of thermal expansion mismatches between the NMOS and PMOS portions. In some embodiments, a called party and a calling party are subscribers to a one-number service. The embodiment may further include plurality of sense amplifiers, where the plurality of sense amplifiers is greater than one and less than the plurality of bit lines in number. In construction, ripraps are thrown into water such that the extra-banking height in the first region is higher than in the second region, and free fall of a weight is repetitively carried out to the first and second regions to consolidate the ripraps.