A semiconductor package and related methods are described. The header further comprises second and third portions having respective states of tension that will cause the second and third portions of the header to curl or bend away from the slider when the first portion of the header is removed, for example, by tearing or cutting. The sealant is a thixotropic gel having a viscosity from about 100,000 centipoise to about 5,000,000 centipoise or is a solid which is non-flowable at room temperature.