Consistent with the present disclosure, a package is provided in which the PLC substrate, for example, is bonded to the underyling carrier though a limited contact area. An integrated circuit comprises a chip within a package assembly, the chip includes a plurality of logic circuits each having at least one power input which should not receive a power voltage exceeding a predetermined maximum operating voltage. The corner-forming section includes a resilient portion shaped to flex and absorb energy upon corner impact, and further is adapted to transfer energy directly to the vehicle frame, thus providing efficient and effective energy absorption upon corner impact.