An exemplary backlight module includes a light source and a light guide plate. The single crystal silicon layer is patterned into a strip. At least one of the corner feet includes a corner foot body with a front wall and partial bodies formed laterally of a center axis of the front wall. In one embodiment, the switching mechanism includes a rotating setting stem and the electronic device is a watch. The anchor assembly includes an anchor and a set screw. The method includes measuring an actual size of the bonding portion of the circuit electrode at the first temperature, comparing the actual size of the bonding portion with a designed size of the bonding portion at the first temperature, and determining a cutting size of the bonding material based on a comparison result and mounting the bonding material over the bonding portion.