A device for testing heat conduction performance of a heat pipe is provided. With the center of a wafer staying in alignment with that of the support mount, the lifter places the wafer onto the surface of the support mount to determine the center of the wafer. This is done by molecular conversion processing conversion unit with a solid particle trap, consisting of a plasma conversion chamber that produces a plasma jet, and an electrostatic filter for the collection of solid particles. When the SP detects an error in the operation of the BIOS based on the notification signal, the SP sends a copy of the failover backup image to the BIOS chip of the host computer through the SPI to replace a current BIOS image stored in the BIOS chip of the host computer with the copy of the failover backup image. The indicator display device includes a stepping motor; an indicator which is connected to the stepping motor and rotates by a driving force provided by the stepping motor; and an indicator position detector which detects a relative position of the indicator with regard to the stepping motor.