The claimed subject matter is directed to a continuous passive temperature, pressure, modulus of elasticity, and force compensated oscillating inertial microbalance and method of using the same. The transmission body defines a reflection groove and a plurality of optical signal splitting holes. The housing has a entrance port and an exit port and encloses a radiation analysis unit. The controller monitors the continuity of the MEMS matrix to determine which elements of the MEMS matrix have failed to accurately determine the accumulated vibration stress experienced by the printed circuit board. The strained silicon layer is then separated from the donor wafer so that the strained silicon layer adheres to the target wafer.