A memory controller including a dual-mode memory interconnect includes an inputoutput circuit including a plurality of input buffers and a plurality of output drivers. An uncured conductive electrode material, such as an uncured silver epoxy material or an uncured silver or equivalent conducting metallic paste material, is disposed at least over a portion of the transparent conductive coating to establish a precursor of at least one metallic electrode at the substrate surface. A compound semiconductor is then formed on the workpiece. be effective at, temperatures of at least 150\xb0 C. The driving current of can be controlled at a constant current and thus be stabilized.